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Continuous assembly of composite strip

There are many ways to process FRP composites and the method of processing needs to be considered in the early stages to decide what is best for each application. The properties of the finished part are affected not just by the properties of the component materials, but also by the way the fibres are incorporated. Better fibre alignment and higher pressure in processing will improve fibre volume fraction, leading to better mechanical properties. The cost of materials, mould tooling and equipment, the required finished properties and the number of parts to be produced will all be factors in deciding the process. This section briefly looks at some of the ways FRPs can be processed, however we recommend that this knowledge is backed up with further education on the topic. This is a skilled manual process which requires low capital investment and is widely used for low-volume products, such as boats and bespoke products.
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CONTINUOUS PROFILED STRIP OFFERS UNLIMITED DESIGN POSSIBILITIES

Continuous assembly of composite strip
Continuous assembly of composite strip
Continuous assembly of composite strip
Continuous assembly of composite strip
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Continuous Preparation of Copper/Carbon Nanotube Composite Films and Application in Solar Cells.

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Continuous Preparation of Copper/Carbon Nanotube Composite Films and Application in Solar Cells.

It can be applied notably to the making of micromodules in integrated circuit form that go into the production of the portable flat cards known as "chip cards". In these cards, the micromodules are formed by a set of elements comprising: a chip in integrated circuit form, metal contacts used for the connection of the micromodule with external devices, linking wires to link the chip to the metal contacts and a protective coat formed by a resin covering the chip, the linking wires and, partially, the metal contacts. To manufacture a micromodule and then incorporate it into a card, a first known method consists in mounting the chip on a metal strip that has been pre-slotted in the form of a conductor grid, soldering the chip to a zone of this grid where it is connected by wires soldered to other zones of the grid, coating the chip and the wires with a drop of protective resin of the epoxy or silicone type in leaving the conductors of the grid partially bared, cutting up the metal strip into individual micromodules, each comprising a coated chip and bared external contacts and then bonding the micromodule to a surface cavity of a card made of plastic material in such a way that grid portions not coated with resin are flush with the surface of the card and constitute the external connector of the card.
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